StyleLine Phono Interface

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Description

Get the most from your vinyl recordings with the MIT Family of Phono Interconnects—
3 Articulation Poles
The StyleLine Phono interface showcases MIT’s breakthrough miniaturization technology with its MPC connector. MIT is able to construct Multipole networks on a wafer so small they fit inside an RCA connector! Measurements in our labs have shown consistently excellent results, allowing this new generation of surface-mounted parts to focus energy. The result is dimensional, natural and without blurring.

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Features & Benefits:

Multipole Technology – wafered within our MPC connectors results in better bass, better midrange and smoother highs.
Quanti-Shield Technology – QST provides 98% RFI noise rejection and chassis-to-chassis ground circuits create a “black background” for audio

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